Ege Engin received his B.S. and M.S. degrees in electrical engineering from Middle East Technical University, Ankara, Turkey, and from University of Paderborn, Germany in 1998 and 2001, respectively. From 2001 to 2004 he was with the Fraunhofer-Institute for Reliability and Microintegration in Berlin. During this time he also received his Ph.D degree with Summa Cum Laude from the University of Hannover, Germany. From 2005 to 2008, Dr. Engin was with the Packaging Research Center at Georgia Tech, where he was an Assistant Director of Research. Since 2008, he is with the Electrical and Computer Engineering Department of San Diego State University. He has more than 100 publications in journals and conferences in the areas of signal and power integrity modeling and simulation, 4 patents, and has presented tutorials in international conferences in the area of high-speed design. He is the co-author of the book "Power Integrity Modeling and Design for Semiconductors and Systems," published by Prentice Hall in 2007, and translated to Japanese and Chinese. Dr. Engin has co-authored publications that received the Outstanding Poster Paper Award in the IEEE Electronic Components and Technology Conference (ECTC) 2006, Best Paper Award Finalist in the Board-Level Design Category at DesignCon 2007, Best Paper of the Session Award in IMAPS Advanced Technology Workshop on RF and Microwave Packaging 2009, and Best Paper of the Session Award in International Symposium on Microelectronics in 2007 and 2016. He is the recipient of the Semiconductor Research Corporation Inventor Recognition Award in 2009, the Outstanding Educator Award from the International Microelectronics Packaging and Assembly Society in 2015, and the IEEE EMC-S M.Kanda Award for the most cited paper in the last 5 years (2013- 2017). Dr. Engin is an Alexander-von-Humboldt Research Fellow.